2024
C.C. Wei, fab, or investor event image.
C.C. Wei became Chairman while continuing as CEO, as TSMC entered a phase of AI demand and global expansion.
TSMC
Timeline
Review key company turning points from newest to oldest.
2020s
CoWoS, advanced packaging, or AI chip wafer image.
AI accelerator demand drove expansion in advanced nodes, CoWoS advanced packaging, and HBM-related supply chain.
2020
Arizona fab construction or campus image.
Announced Arizona fab plans, making global capacity footprint a shared customer and policy focus.
2018
7nm wafer or advanced-node image.
7nm volume production supported smartphone, HPC, and AI chip customers, widening advanced-node leadership.
2011
Wafer manufacturing line image.
Scaled key nodes such as 28nm, serving more fabless customers through the pure-play foundry model.
2005
Packaging process or customer collaboration image.
Advanced packaging and customer co-design capabilities began compounding toward later AI system-level packaging.
1987
Morris Chang or early TSMC fab image.
Morris Chang founded TSMC and established the pure-play foundry model, changing global semiconductor specialization.